ELAP
ELAP Scholarships (Canada) – 2022
Developed by the Canadian Government, the Emerging Leaders in the Americas Program (ELAP) offers scholarships to undergraduate and graduate students (master’s and doctoral level) from Latin America and the Caribbean for an exchange program at Canadian universities.
Please note that SINTER manages the applications of UFSC undergraduate students only.
ATTENTION: Questions related to proficiency certificates and general documentation, required by the selected institution, must be solved directly with the host institution.
Please check here* the details for application and download the file to access the links.
The table below shows the deadlines and places available for each institution. SINTER is in touch with the Canadian partner institutions and will update the table as soon as new information is received.
Considering the time available for internal procedures, the deadline for application at UFSC cannot be extended. By the deadline indicated in the table, applicants must be registered in the UFSC online application system and must have submitted to SINTER all application documents, including the learning agreement (UFSC template) signed and stamped by their program coordinator and without SINTER’s signature.
Institution | Deadline for application at UFSC | Places* |
Université de Montréal – UdeM | Applications Closed | 2 |
University of Winnipeg | Applications Closed | 1 |
Polytechnique Montréal | 2 March 2023 | 5 |
Date of last update: 22 February 2023
* The number of places offered in each institution is set in the bilateral agreements between UFSC and the Canadian institutions. Being selected for one of the places at a Canadian institution does not ensure that the student will be participating in the ELAP Program. The student selected for one institution who is not granted with the ELAP Scholarship will have the option to go on exchange in that university using their own financial resources.
If you have any questions, please contact us at outgoing.sinter@contato.ufsc.br.
Further information: